AMKR   $30.96  -2.18% Market Closed After Close 32.0874 3.64%

Amkor Technology Inc
Last Events:

2023-08-09 Signal in RSI changed from bearish to bullish. RSI indicator is in the upper part of the neutral territory and it heading north. These factors indicate that positive dynamics is recovering. Last signal: entrance to the overbought zone.

2023-08-09 Signal in EMA20 changed from bearish reversal to bullish reversal. The price is trying to cross up the moving average line If the intersection will be successful, then an upside trend can be formed.

2023-08-06 Signal in Stochastic changed from bearish reversal to bearish. The stochastic indicator is in the lower part of the neutral territory and it falls. These factors indicate that negative dynamics persists. Last signal: down-crossing the middle level.

2023-08-05 Signal in RSI changed from bullish weakening to bearish. RSI indicator is in the lower part of the neutral territory and it falls. These factors indicate that negative dynamics persists. Last signal: exit from the overbought zone.

2023-08-05 Signal in EMA20 changed from bullish reversal to bearish reversal. The price is trying to cross down the moving average line If the intersection will be successful, then a downside trend can be formed.

2023-08-04 Signal in Stochastic changed from bullish to bearish reversal. The stochastic indicator is in the upper part of the neutral territory and left the overbought territory. These factors indicate that perhaps the upside trend is coming to an end price will probably head south Last signal: main and signal line crossing.

2023-08-04 Signal in MACD changed from bullish recovery to bullish weakening. Oscillator MACD is in the positive territory it's lower than the signal line and falls. These factors mean that the growing period is over. Last signal: main and signal line crossing.

2023-08-04 Signal in RSI changed from bullish recovery to bullish weakening. RSI indicator is in the upper part of the neutral territory and it heading south. These factors indicate that the downside trend is forming. Last signal: exit from the overbought zone.


Current temperature: 27.39
ST: 0, Cor:

50-50 Year Forecast
Low with % probability:
Target: 28.44
High with % probability:
Analyst Recommendations:
Number of estimates 7
Target Price Mean 40.14
Mean unverified/preliminary 40.14 / 40.14
Target Price Low / High 35.00 / 45.00
Median / STD DEV 40.00 / 4.06
Tech Forecasts:
More signals
  < 1M 1-3M > 3M
total Buy None Sell
rsi Sell Sell Sell
macd ActivelyBuy None None
stoch ActivelyBuy None None
ma20 None ActivelyBuy Sell
ma50 ActivelyBuy None None
ma100 Buy None None
Candlestick PatternSept. 10, 2024 Dragon Fly - is formed when the opening and the closing prices are at the highest of the day. If it has a longer lower shadow it signals a more bullish trend. When appearing at market bottoms it is considered to be a reversal signal.
ISIN US0316521006
ceo Mr. Giel Rutten
Website https://amkor.com
Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, the Middle East, Africa, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage. The company also provides wafer-level CSP packages for power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages used in power management, transceivers, radar, and specialty silicon; silicon wafer integrated fan-out technology that replaces a laminate substrate with a thinner structure; leadframe packages for electronic devices and mixed-signal applications; and substrate-based wirebond packages used to connect a die to a substrate. In addition, it offers micro-electro-mechanical systems packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. Further, the company provides wafer, package, and system level test services, as well as burn-in test and test development services. It serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. The company was founded in 1968 and is headquartered in Tempe, Arizona.